JPH0341978B2 - - Google Patents

Info

Publication number
JPH0341978B2
JPH0341978B2 JP56191267A JP19126781A JPH0341978B2 JP H0341978 B2 JPH0341978 B2 JP H0341978B2 JP 56191267 A JP56191267 A JP 56191267A JP 19126781 A JP19126781 A JP 19126781A JP H0341978 B2 JPH0341978 B2 JP H0341978B2
Authority
JP
Japan
Prior art keywords
reactor
semiconductor layer
substrate
plasma
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56191267A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5892217A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP56191267A priority Critical patent/JPS5892217A/ja
Publication of JPS5892217A publication Critical patent/JPS5892217A/ja
Publication of JPH0341978B2 publication Critical patent/JPH0341978B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Photovoltaic Devices (AREA)
JP56191267A 1981-11-28 1981-11-28 半導体装置作製方法 Granted JPS5892217A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56191267A JPS5892217A (ja) 1981-11-28 1981-11-28 半導体装置作製方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56191267A JPS5892217A (ja) 1981-11-28 1981-11-28 半導体装置作製方法

Publications (2)

Publication Number Publication Date
JPS5892217A JPS5892217A (ja) 1983-06-01
JPH0341978B2 true JPH0341978B2 (en]) 1991-06-25

Family

ID=16271694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56191267A Granted JPS5892217A (ja) 1981-11-28 1981-11-28 半導体装置作製方法

Country Status (1)

Country Link
JP (1) JPS5892217A (en])

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5468653A (en) * 1982-08-24 1995-11-21 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and method of making the same
US6664566B1 (en) 1982-08-24 2003-12-16 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and method of making the same
US5391893A (en) * 1985-05-07 1995-02-21 Semicoductor Energy Laboratory Co., Ltd. Nonsingle crystal semiconductor and a semiconductor device using such semiconductor
USRE37441E1 (en) 1982-08-24 2001-11-13 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device
JPS59115574A (ja) 1982-12-23 1984-07-04 Semiconductor Energy Lab Co Ltd 光電変換装置作製方法
JPH06105794B2 (ja) * 1983-10-18 1994-12-21 株式会社半導体エネルギー研究所 炭化珪素半導体作製方法
JPS59165468A (ja) * 1983-03-10 1984-09-18 Shin Etsu Chem Co Ltd 太陽電池用窓枠材の製造方法
JPS60130822A (ja) * 1983-12-19 1985-07-12 Semiconductor Energy Lab Co Ltd 発光半導体装置の作製方法
JPS60130821A (ja) * 1983-12-19 1985-07-12 Semiconductor Energy Lab Co Ltd 半導体装置作製方法
JPS60154521A (ja) * 1984-01-23 1985-08-14 Semiconductor Energy Lab Co Ltd 炭化珪素被膜作製方法
US4727044A (en) 1984-05-18 1988-02-23 Semiconductor Energy Laboratory Co., Ltd. Method of making a thin film transistor with laser recrystallized source and drain
US7038238B1 (en) 1985-05-07 2006-05-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a non-single crystalline semiconductor layer
JPS62113482A (ja) * 1985-11-12 1987-05-25 Sanyo Electric Co Ltd 光起電力装置
US4845043A (en) * 1987-04-23 1989-07-04 Catalano Anthony W Method for fabricating photovoltaic device having improved short wavelength photoresponse
JPH01212478A (ja) * 1988-02-19 1989-08-25 Semiconductor Energy Lab Co Ltd 光電変換装置
KR950013784B1 (ko) * 1990-11-20 1995-11-16 가부시키가이샤 한도오따이 에네루기 겐큐쇼 반도체 전계효과 트랜지스터 및 그 제조방법과 박막트랜지스터
US5849601A (en) * 1990-12-25 1998-12-15 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and method for manufacturing the same
JP2814161B2 (ja) 1992-04-28 1998-10-22 株式会社半導体エネルギー研究所 アクティブマトリクス表示装置およびその駆動方法
US6693681B1 (en) 1992-04-28 2004-02-17 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and method of driving the same
JP3571404B2 (ja) * 1995-03-03 2004-09-29 アネルバ株式会社 プラズマcvd装置及びその場クリーニング後処理方法
US5599732A (en) * 1995-08-21 1997-02-04 Northwestern University Method for growing III-V semiconductor films using a coated reaction chamber
US6020035A (en) 1996-10-29 2000-02-01 Applied Materials, Inc. Film to tie up loose fluorine in the chamber after a clean process
TW460943B (en) * 1997-06-11 2001-10-21 Applied Materials Inc Reduction of mobile ion and metal contamination in HDP-CVD chambers using chamber seasoning film depositions
US7109114B2 (en) 2004-05-07 2006-09-19 Applied Materials, Inc. HDP-CVD seasoning process for high power HDP-CVD gapfil to improve particle performance
KR101455304B1 (ko) 2007-10-05 2014-11-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박막트랜지스터, 및 박막트랜지스터를 가지는 표시장치, 및그들의 제작방법
JP5311957B2 (ja) 2007-10-23 2013-10-09 株式会社半導体エネルギー研究所 表示装置及びその作製方法
JP5311955B2 (ja) 2007-11-01 2013-10-09 株式会社半導体エネルギー研究所 表示装置の作製方法
TWI481029B (zh) 2007-12-03 2015-04-11 半導體能源研究所股份有限公司 半導體裝置
KR101523353B1 (ko) 2007-12-03 2015-05-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박막트랜지스터 및 반도체 장치
EP2073255B1 (en) 2007-12-21 2016-08-10 Semiconductor Energy Laboratory Co., Ltd. Diode and display device comprising the diode
JP5416460B2 (ja) 2008-04-18 2014-02-12 株式会社半導体エネルギー研究所 薄膜トランジスタおよび薄膜トランジスタの作製方法
WO2009128522A1 (en) 2008-04-18 2009-10-22 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor and method for manufacturing the same
WO2009128553A1 (en) 2008-04-18 2009-10-22 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor and method for manufacturing the same
US8053294B2 (en) 2008-04-21 2011-11-08 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of thin film transistor by controlling generation of crystal nuclei of microcrystalline semiconductor film
JP5542364B2 (ja) 2008-04-25 2014-07-09 株式会社半導体エネルギー研究所 薄膜トランジスタの作製方法
CN102077331B (zh) 2008-06-27 2014-05-07 株式会社半导体能源研究所 薄膜晶体管
US8283667B2 (en) 2008-09-05 2012-10-09 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor
JP5498762B2 (ja) 2008-11-17 2014-05-21 株式会社半導体エネルギー研究所 薄膜トランジスタの作製方法
WO2010103906A1 (en) 2009-03-09 2010-09-16 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor
JP5888802B2 (ja) 2009-05-28 2016-03-22 株式会社半導体エネルギー研究所 トランジスタを有する装置
TWI538218B (zh) 2010-09-14 2016-06-11 半導體能源研究所股份有限公司 薄膜電晶體
US8338240B2 (en) 2010-10-01 2012-12-25 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing transistor

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138237A (en) * 1979-04-13 1980-10-28 Fujitsu Ltd Manufacture of semiconductor device
JPS55154781A (en) * 1979-05-22 1980-12-02 Shunpei Yamazaki Semiconductor device

Also Published As

Publication number Publication date
JPS5892217A (ja) 1983-06-01

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